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STPS1L60
Power Schottky rectifier
Features

Negligible switching losses Low forward voltage drop Surface mount miniature packages Avalanche capability specified
DO-41 STPS1L60
K A
Description
Axial and surface mount power Schottky rectifiers suited to switched mode power supplies and high frequency DC to DC converters. Packaged in SMA, STmite flat and DO-41, this device is especially intended for use in low voltage, high frequency inverters and small battery chargers.
K A
A K
STmite flat (DO222-AA) STPS1L60MF
SMA (JEDEC DO-214AC) STPS1L60A
Table 1.
Device summary
Symbol IF(AV) VRRM Tj (max) VF(max) Value 1A 60 V 150 C 0.56 V
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Characteristics
STPS1L60
1
Characteristics
Table 2.
Symbol VRRM IF(RMS)
Absolute ratings (limiting values)
Parameter Repetitive peak reverse voltage STmite flat Forward rms current SMA, DO-41 SMA TL = 130 C = 0.5 TL = 120 C = 0.5 TC = 135 C = 0.5 tp =10 ms sinusoidal tp = 1 s Tj = 25 C
(1)
Value 60 2 10
Unit V A A
IF(AV)
Average forward current
DO-41 STmite flat
1
A
IFSM PARM Tstg Tj dV/dt
1.
Surge non repetitive forward current Repetitive peak avalanche power Storage temperature range Maximum operating junction temperature Critical rate of rise of reverse voltage
40 1200 - 65 to + 150 150 10000
A W C C V/s
1 dPtot < condition to avoid thermal runaway for a diode on its own heatsink Rth(j-a) dTj
Table 3.
Symbol Rth(j-a)
Thermal resistance
Parameter SMA Junction to ambient Lead length = 10 mm Junction to lead Lead length = 10 mm Junction to case DO-41 STmite flat 45 20 C/W DO-41 SMA 100 30 C/W Value 120 C/W Unit
Rth(j-l) Rth(j-c)
Table 4.
Symbol IR(1)
Static electrical characteristics
Parameter Reverse leakage current Tests conditions Tj = 25 C Tj = 100 C Tj = 25 C Tj = 100 C IF = 1 A VR = VRRM Min. Typ. Max. 50 1.5 5 0.57 0.56 0.5 0.54 V 0.75 0.68 0.6 0.66 Unit A mA
VF(1)
Forward voltage drop
Tj = 125 C Tj = 25 C Tj = 100 C IF = 2 A Tj = 125 C
1. Pulse test: tp = 380 s, < 2%
To evaluate the conduction losses use the following equation: P = 0.44 x IF(AV) + 0.12 IF2(RMS)
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Characteristics
Figure 1.
Average forward power dissipation Figure 2. versus average forward current
IF(AV)(A)
Average forward current versus ambient temperature ( = 0.5) (SMA)
0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1
PF(AV)(W)
= 0.05 = 0.1 = 0.2 = 0.5
1.2 1.0
Rth(j-a) = Rth(j-l)
SMA
=1
0.8 0.6 0.4
T
Rth(j-a) = 120 C/W
T
0.2
IF(AV)(A)
0.2 0.4 0.6 0.8
= tp / T
tp
0.0 1.2 0
= tp / T
tp
50
0.0 0.0
Tamb(C)
75 100 125 150
1.0
25
Figure 3.
Average forward current versus ambient temperature ( = 0.5) (DO-41)
DO-41
Figure 4.
Average forward current versus ambient temperature ( = 0.5) (STmite flat)
STmite flat
1.2 1.0 0.8 0.6 0.4
IF(AV)(A)
Rth(j-a) = Rth(j-l)
1.2 1.0 0.8 Rth(j-a) = 100 C/W 0.6 0.4
IF(AV)(A)
Rth(j-a) = Rth(j-c)
Rth(j-a) = 250 C/W
T
T
0.2
= tp / T
0.2
tp
50
0.0 0 25
Tamb(C)
75 100 125 150
= tp / T
tp
50 75
0.0 0 25
Tamb(C)
100 125 150
Figure 5.
Normalized avalanche power derating versus pulse duration
Figure 6.
Normalized avalanche power derating versus junction temperature
PARM(tp) PARM(1 s)
1 1.2 1 0.1 0.8 0.6 0.4 0.2 0.001 0.01 0.1 1
PARM(Tj) PARM(25 C)
0.01
tp(s)
10 100 1000
Tj(C)
0 25 50 75 100 125 150
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Characteristics
STPS1L60
Figure 7.
Non repetitive surge peak forward current versus overload duration (maximum values) (SMA)
SMA
Figure 8.
Non repetitive surge peak forward current versus overload duration (maximum values) (DO-41)
DO-41
7 6 5
IM(A)
8 7 6
IM(A)
Ta = 25 C 4 3 2 1 IM t = 0.5 1.E-03 Ta = 75 C
5 4 3
Ta = 25 C Ta = 75 C
Ta = 125 C
2 IM 1 t = 0.5 1.E-03
Ta = 125 C
0 1.E-04
t(s)
1.E-02 1.E-01 1.E+00
t(s)
1.E-02 1.E-01 1.E+00
0 1.E-04
Figure 9.
Non repetitive surge peak forward current versus overload duration (maximum values) (STmite flat)
STmite flat
Figure 10. Relative variation of thermal impedance junction to ambient versus pulse duration (SMA)
1.0 0.9 0.8 0.7 0.6
18 16 14 12 10 8 6 4 2
IM(A)
Zth(j-a)/Rth(j-a)
Epoxy printed circuit board, copper thickness = 35 m, recommended pad layout SMA
Tc = 25 C Tc = 75 C IM t = 0.5 1.E-03 Tc = 125 C
0.5 0.4 0.3 0.2 0.1 Single pulse
t(s)
1.E-02 1.E-01 1.E+00
0 1.E-04
0.0 1.E-02
tp(s)
1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
Figure 11. Relative variation of thermal impedance junction to ambient versus pulse duration (DO-41)
1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 1.E-02 Single pulse
Figure 12. Relative variation of thermal impedance junction to ambient versus pulse duration (STmite flat)
1.0 0.9
Zth(j-a)/Rth(j-a)
Epoxy printed circuit board, copper thickness = 35 m, recommended pad layout
Zth(j-a)/Rth(j-a)
Epoxy printed circuit board, copper thickness = 35 m, recommended pad layout
STmite flat
DO-41
0.8 0.7 0.6 0.5 0.4 0.3 0.2
Single pulse
tp(s)
1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
0.1 0.0 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02
tp(s)
1.E+03
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Characteristics
Figure 13. Reverse leakage current versus reverse voltage applied (typical values)
1.E+02
Figure 14. Junction capacitance versus reverse voltage applied (typical values)
1000
IR(mA)
Tj = 150 C
C(pF)
F = 1 MHz Vosc = 30 mVRMS Tj = 25 C
1.E+01
Tj = 125 C Tj = 100 C Tj = 75 C 100
1.E+00
1.E-01 Tj = 50 C 1.E-02 Tj = 25 C
1.E-03 0
VR(V)
5 10 15 20 25 30 35 40 45 50 55 60
10 1 10
VR(V)
100
Figure 15. Forward voltage drop versus forward current (typical values, high level)
10.00
Figure 16. Forward voltage drop versus forward current (typical values, low level)
3.0
IFM(A)
Tj = 125 C
IFM(A)
Tj = 125 C
2.5 1.00 Tj = 25 C 2.0
Tj = 25 C 1.5 0.10 1.0 0.5 0.01 0.0
VFM(V)
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8
0.0 0.0
VFM(V)
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9
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Characteristics
STPS1L60
Figure 17. Thermal resistance junction to ambient versus copper surface under each lead (SMA)
140 120 100 80
Figure 18. Thermal resistance versus lead length (DO-41)
Rth(C/W)
DO-41 Rth(j-a)
Rth(j-a)(C/W)
Epoxy printed circuit board FR4 copper thickness = 35 m SMA
120 100 80 60
Rth(j-l)
60 40 40 20 0 0.0 20
Scu(cm)
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
0 5 10 15 20
Lleads(mm)
25
Figure 19. Thermal resistance junction to ambient versus copper surface under tab (STmite flat)
250 225 200 175 150 125 100 75 50 25 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
Rth(j-a)(C/W)
Epoxy printed circuit board FR4 copper thickness = 35 m
STmite flat
Scu(cm)
4.5 5.0
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STPS1L60
Package information
2
Package information

Epoxy meets UL94, V0 Band indicates cathode
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK(R) packages, depending on their level of environmental compliance. ECOPACK(R) specifications, grade definitions and product status are available at: www.st.com. ECOPACK(R) is an ST trademark. Table 5. SMA dimensions
Dimensions Ref.
E1
Millimeters Min. Max. 2.45 0.20 1.65 0.40 2.90 5.35 4.60 1.50
Inches Min. 0.075 0.002 0.049 0.006 0.089 0.189 0.156 0.030 Max. 0.094 0.008 0.065 0.016 0.114 0.211 0.181 0.059
D
A1 A2 b
1.90 0.05 1.25 0.15 2.25 4.80 3.95 0.75
E
c
A1
D E
b
C L
A2
E1 L
Figure 20. Footprint, dimensions in mm (inches)
1.4 (0.055) 2.63 (0.103) 1.4 (0.055)
1.64 (0.064)
5.43 (0.214)
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Package information Table 6. STmite flat dimensions
Dimensions Ref. Millimeters Min.
E1 L L1
STPS1L60
Inches Min. Typ. Max.
Typ. 0.85 0.55 0.85 0.15 1.90 3.80 2.95 0.55 2.40 0.60 0.35
Max. 0.95 0.65 1.00 0.25 2.05 3.90 3.10 0.80 2.60 0.75 0.50
A
L2
0.80 0.40 0.70 0.10 1.75 3.60 2.80 0.50 2.10 0.45 0.20
0.031 0.033 0.037 0.016 0.022 0.026 0.027 0.033 0.039 0.004 0.006 0.009 0.069 0.075 0.081 0.142 0.150 0.154 0.110 0.116 0.122 0.020 0.022 0.031 0.083 0.094 0.102 0.018 0.024 0.030 0.008 0.014 0.020
b
D b b2
b2 c D E E1 L L1 L2 L3
E
L3
c A
Figure 21. Footprint dimensions
0.85 0.63
(0.033) (.025)
2.00
(0.079)
0.65
(.026)
(0.026)
0.65
(0.037)
0.95
1.95
(0.077)
4.13
(0.163)
millimeters
(inches)
Table 7.
DO-41 (plastic) dimensions
Dimensions Ref.
OD OB
Millimeters Min. Max. 5.20 2.71
Inches Min. 0.160 0.080 1 Max. 0.205 0.107
A
C A C
4.07 2.04 25.4 0.71
B C D
0.86
0.028
0.034
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Ordering information
3
Ordering information
Table 8. Ordering information
Marking GB6 STPS1L60 STPS1L60 F1L6 Package SMA DO-41 DO-41 STmite flat Weight 0.068 g 0.34 g 0.34 g 0.016 g Base qty 5000 2000 5000 12000 Delivery mode Tape and reel Ammopack Tape and reel Tape and reel
Order code STPS1L60A STPS1L60 STPS1L60RL STPS1L60MF
4
Revision history
Table 9.
Date Jul-2003 Aug-2004 25-Jun-2009 30-Sep-2009
Document revision history
Revision 5A 6 7 8 Last update. SMA package dimensions update. Reference A1 max changed from 2.70 mm (0.106 inc.) to 2.03 mm (0.080 inc). Added package STmite flat. Updated ECOPACK statement. Updated table 7 ref. " C ". Changes
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STPS1L60
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